The Resource Advanced Materials for Thermal Management of Electronic Packaging, by Xingcun Colin Tong, (electronic resource)

Advanced Materials for Thermal Management of Electronic Packaging, by Xingcun Colin Tong, (electronic resource)

Label
Advanced Materials for Thermal Management of Electronic Packaging
Title
Advanced Materials for Thermal Management of Electronic Packaging
Statement of responsibility
by Xingcun Colin Tong
Creator
Author
Author
Subject
Language
  • eng
  • eng
Summary
The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging. Key Features: •Covers ceramics and glasses, polymers, metals, metallic composites, multi-material laminates, carbonaceous materials, and carbon-matrix composites •Provides the reader with a comprehensive understanding of thermal management solutions •Includes fundamentals of heat transfer and materials characterization techniques •Assesses cost and performance in thermal management
Member of
Is Subseries of
http://library.link/vocab/creatorName
Tong, Xingcun Colin
Dewey number
621.381
http://bibfra.me/vocab/relation/httpidlocgovvocabularyrelatorsaut
jbc-mXX-_SM
Language note
English
LC call number
TK7867-7867.5
Literary form
non fiction
Nature of contents
dictionaries
Series statement
Springer Series in Advanced Microelectronics,
Series volume
30
http://library.link/vocab/subjectName
  • Optical materials
  • Engineering
  • Electronics
  • Electronic Circuits and Devices
  • Optical and Electronic Materials
  • Engineering Thermodynamics, Heat and Mass Transfer
  • Electronics and Microelectronics, Instrumentation
Label
Advanced Materials for Thermal Management of Electronic Packaging, by Xingcun Colin Tong, (electronic resource)
Instantiates
Publication
Note
Description based upon print version of record
Bibliography note
Includes bibliographical references and index
Carrier category
online resource
Carrier category code
  • cr
Content category
text
Content type code
  • txt
Contents
CH. 1. Thermal managing fundamentals and design guide in electronic packaging -- 1.1 Introduction -- 1.2 Thermal management challenges and common -- concerns -- 1.3 Fundamentals of heat transfer -- 1.4 Thermal management solutions -- 1.5 Design for advanced thermal management of electronic packaging -- 1.6 Materials selection for advanced thermal management -- 1.7 Environmental compliance of thermal managing materials -- CH. 2. Characterization methodology of thermal managing materials -- 2.1 Thermal properties and measurement techniques -- 2.2 Electrical properties and measurement techniques -- 2.3 Thermomechanical characterization -- 2.4 Analytical techniques for materials characterization -- 2.5 Surface finish and contact interface compatibility -- 2.6 Reliability analysis and environmental performance evaluation -- CH. 3. Electronic packaging materials and their thermal managements -- 3.1 Materials selection for electronic packaging -- 3.2 Ceramics and semiconductors -- 3.3 Electronic glasses -- 3.4 Polymers -- 3.5 Monolithic metals -- 3.6 Metallic composites -- 3.7 Multimaterial laminates -- 3.8 Printed Circuit Board (PCB) Materials -- 3.9 Thermal interface materials -- 3.10 Advanced thermally conductive materials -- CH. 4. THERMALLY conductive carbonaceous materials and carbon matrix composites -- 4.1 Introduction -- 4.2 Natural and industrial graphite -- 4.3 Pyrolytic graphite -- 4.4 Graphite/Carbon Foams -- 4.5 Thermally conductive carbon fibers -- 4.6 Diamond -- 4.7 Carbon Nanotubes -- 4.8 Carbon/carbon composites -- CH. 5. Thermally conductive polymer matrix composites -- 5.1 Introduction -- 5.2 Polymer matrix types -- 5.3 Reinforcements selection and its effect on thermal conductivity -- 5.4 General fabrication and manufacturing processes -- 5.5 Types and applications for thermal management -- CH. 6. High thermal conductivity metal matrix composites -- 6.1 Introduction -- 6.2 Processing of metal matrix composites -- 6.3 Aluminum matrix composites -- 6.4 Copper matrix composites -- 6.5 Other metal matrix composites -- CH. 7. Thermally conductive ceramic matrix composites -- 7.1 Introduction -- 7.2 Diamond-SiC composites -- 7.3 Carbon-SiC Composites -- 7.4 Reaction-Bonded SiC -- 7.5 Aluminum-toughened SiC -- 7.6 CNT/Ceramic- carbon nanotube composites -- CH. 8. Thermal interface materials in electronic packaging -- 8.1 Thermal contact conductance and requirement for thermal interface materials -- 8.2 Metallic thermal interface materials -- 8.3 Thermal grease -- 8.4 Thermally conductive elastomer materials -- 8.5 Phase change materials -- 8.6 Polymer solder hybrid materials -- 8.7 Fiber-reinforced thermal interface materials -- 8.8 Graphite based thermal interface material -- 8.9 Nanotechnology based thermal interface materials -- 8.10 Thermal interface materials selection -- CH. 9. Materials and design of advanced heat spreader and air cooling heat sink -- 9.1 Introduction -- 9.2 Spreading and constriction resistance -- 9.3 Type of heat spreaders and their materials selection -- 9.4 Air cooling heat sink -- 9.4.1 Heat sink design constraints and design parameters -- 9.5 Nanostructure heat sink and complex spreader sink -- CH. 10. Liquid cooling devices and materials selection -- 10.1 Introduction -- 10.2 Indirect single-phase liquid cooling -- 10.3 Direct immersion cooling -- 10.4 Spray cooling and jet impingement -- 10.5 Heat pipe cooling -- 10.6 Refrigeration cooling -- 10.7 High-flux cooling with phase-change heat transfer -- CH. 11. Thermoelectric cooling through thermoelectric materials -- 11.1 Introduction -- 11.2 Thermoelectric effects -- 11.3 Design and architecture of thermoelectric cooling devices -- 11.4 Thermoelectric materials and future development trends -- CH. 12. Development and applications of advanced thermal managing materials -- 12.1 Materials development routine and methodology -- 12.2 Smart composites and multifunctional materials for thermal management -- 12.3 Thermal managing materials with enhanced EMI shielding and absorbing performance -- 12.4 Applications -- 12.5 Future trends.-
Dimensions
unknown
Edition
1st ed. 2011.
Extent
1 online resource (632 p.)
Form of item
online
Isbn
9781283083591
Media category
computer
Media type code
  • c
Other control number
10.1007/978-1-4419-7759-5
Specific material designation
remote
System control number
  • (CKB)2670000000064906
  • (EBL)667098
  • (OCoLC)701369360
  • (SSID)ssj0000475819
  • (PQKBManifestationID)11312361
  • (PQKBTitleCode)TC0000475819
  • (PQKBWorkID)10478992
  • (PQKB)11484792
  • (DE-He213)978-1-4419-7759-5
  • (MiAaPQ)EBC667098
  • (EXLCZ)992670000000064906
Label
Advanced Materials for Thermal Management of Electronic Packaging, by Xingcun Colin Tong, (electronic resource)
Publication
Note
Description based upon print version of record
Bibliography note
Includes bibliographical references and index
Carrier category
online resource
Carrier category code
  • cr
Content category
text
Content type code
  • txt
Contents
CH. 1. Thermal managing fundamentals and design guide in electronic packaging -- 1.1 Introduction -- 1.2 Thermal management challenges and common -- concerns -- 1.3 Fundamentals of heat transfer -- 1.4 Thermal management solutions -- 1.5 Design for advanced thermal management of electronic packaging -- 1.6 Materials selection for advanced thermal management -- 1.7 Environmental compliance of thermal managing materials -- CH. 2. Characterization methodology of thermal managing materials -- 2.1 Thermal properties and measurement techniques -- 2.2 Electrical properties and measurement techniques -- 2.3 Thermomechanical characterization -- 2.4 Analytical techniques for materials characterization -- 2.5 Surface finish and contact interface compatibility -- 2.6 Reliability analysis and environmental performance evaluation -- CH. 3. Electronic packaging materials and their thermal managements -- 3.1 Materials selection for electronic packaging -- 3.2 Ceramics and semiconductors -- 3.3 Electronic glasses -- 3.4 Polymers -- 3.5 Monolithic metals -- 3.6 Metallic composites -- 3.7 Multimaterial laminates -- 3.8 Printed Circuit Board (PCB) Materials -- 3.9 Thermal interface materials -- 3.10 Advanced thermally conductive materials -- CH. 4. THERMALLY conductive carbonaceous materials and carbon matrix composites -- 4.1 Introduction -- 4.2 Natural and industrial graphite -- 4.3 Pyrolytic graphite -- 4.4 Graphite/Carbon Foams -- 4.5 Thermally conductive carbon fibers -- 4.6 Diamond -- 4.7 Carbon Nanotubes -- 4.8 Carbon/carbon composites -- CH. 5. Thermally conductive polymer matrix composites -- 5.1 Introduction -- 5.2 Polymer matrix types -- 5.3 Reinforcements selection and its effect on thermal conductivity -- 5.4 General fabrication and manufacturing processes -- 5.5 Types and applications for thermal management -- CH. 6. High thermal conductivity metal matrix composites -- 6.1 Introduction -- 6.2 Processing of metal matrix composites -- 6.3 Aluminum matrix composites -- 6.4 Copper matrix composites -- 6.5 Other metal matrix composites -- CH. 7. Thermally conductive ceramic matrix composites -- 7.1 Introduction -- 7.2 Diamond-SiC composites -- 7.3 Carbon-SiC Composites -- 7.4 Reaction-Bonded SiC -- 7.5 Aluminum-toughened SiC -- 7.6 CNT/Ceramic- carbon nanotube composites -- CH. 8. Thermal interface materials in electronic packaging -- 8.1 Thermal contact conductance and requirement for thermal interface materials -- 8.2 Metallic thermal interface materials -- 8.3 Thermal grease -- 8.4 Thermally conductive elastomer materials -- 8.5 Phase change materials -- 8.6 Polymer solder hybrid materials -- 8.7 Fiber-reinforced thermal interface materials -- 8.8 Graphite based thermal interface material -- 8.9 Nanotechnology based thermal interface materials -- 8.10 Thermal interface materials selection -- CH. 9. Materials and design of advanced heat spreader and air cooling heat sink -- 9.1 Introduction -- 9.2 Spreading and constriction resistance -- 9.3 Type of heat spreaders and their materials selection -- 9.4 Air cooling heat sink -- 9.4.1 Heat sink design constraints and design parameters -- 9.5 Nanostructure heat sink and complex spreader sink -- CH. 10. Liquid cooling devices and materials selection -- 10.1 Introduction -- 10.2 Indirect single-phase liquid cooling -- 10.3 Direct immersion cooling -- 10.4 Spray cooling and jet impingement -- 10.5 Heat pipe cooling -- 10.6 Refrigeration cooling -- 10.7 High-flux cooling with phase-change heat transfer -- CH. 11. Thermoelectric cooling through thermoelectric materials -- 11.1 Introduction -- 11.2 Thermoelectric effects -- 11.3 Design and architecture of thermoelectric cooling devices -- 11.4 Thermoelectric materials and future development trends -- CH. 12. Development and applications of advanced thermal managing materials -- 12.1 Materials development routine and methodology -- 12.2 Smart composites and multifunctional materials for thermal management -- 12.3 Thermal managing materials with enhanced EMI shielding and absorbing performance -- 12.4 Applications -- 12.5 Future trends.-
Dimensions
unknown
Edition
1st ed. 2011.
Extent
1 online resource (632 p.)
Form of item
online
Isbn
9781283083591
Media category
computer
Media type code
  • c
Other control number
10.1007/978-1-4419-7759-5
Specific material designation
remote
System control number
  • (CKB)2670000000064906
  • (EBL)667098
  • (OCoLC)701369360
  • (SSID)ssj0000475819
  • (PQKBManifestationID)11312361
  • (PQKBTitleCode)TC0000475819
  • (PQKBWorkID)10478992
  • (PQKB)11484792
  • (DE-He213)978-1-4419-7759-5
  • (MiAaPQ)EBC667098
  • (EXLCZ)992670000000064906

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