The Resource High speed digital design : design of high speed interconnects and signaling, Hanqiao Zhang, Steve Krooswyk, Jeff Ou

High speed digital design : design of high speed interconnects and signaling, Hanqiao Zhang, Steve Krooswyk, Jeff Ou

Label
High speed digital design : design of high speed interconnects and signaling
Title
High speed digital design
Title remainder
design of high speed interconnects and signaling
Statement of responsibility
Hanqiao Zhang, Steve Krooswyk, Jeff Ou
Title variation
Design of high speed interconnects and signaling
Creator
Contributor
Author
Subject
Genre
Language
  • eng
  • eng
Summary
High Speed Digital Design discusses the major factors to consider in designing a high speed digital system and how design concepts affect the functionality of the system as a whole. It will help you understand why signals act so differently on a high speed digital system, identify the various problems that may occur in the design, and research solutions to minimize their impact and address their root causes. The authors offer a strong foundation that will help you get high speed digital system designs right the first time. Taking a systems design approach, High Speed Digital Design offers a
Cataloging source
MiAaPQ
http://library.link/vocab/creatorName
Zhang, Hanqiao
Dewey number
621.398
Illustrations
  • illustrations
  • charts
Index
index present
Language note
English
LC call number
TK7868.D5
LC item number
Z43 2015
Literary form
non fiction
Nature of contents
dictionaries
http://library.link/vocab/relatedWorkOrContributorName
  • Krooswyk, Steve
  • Ou, Zhe-Yu Jeff
http://library.link/vocab/subjectName
  • Digital electronics
  • Logic design
Label
High speed digital design : design of high speed interconnects and signaling, Hanqiao Zhang, Steve Krooswyk, Jeff Ou
Instantiates
Publication
Copyright
Note
Includes index
Bibliography note
Includes bibliographical references and index
Carrier category
online resource
Carrier category code
cr
Content category
text
Content type code
txt
Contents
  • Front Cover; High Speed Digital Design; Copyright Page; Contents; About the Authors/Contributors; 1 Transmission line fundamentals; Basic Electromagnetics; Electromagnetics Field Theory; Maxwell's equations; Ampere's law; Faraday's law; Gauss's law; Gauss's law for magnetism; Propagation of Plane Waves; Uniform plane wave; Uniform plane wave in conductive media; Power flow and the Poynting vector; Transmission Line Theory; Wave Equations on Lossless Transmission Lines; Lossless transmission line; Wave propagation on a lossless transmission line; Incident waves and reflected waves
  • Impedance, Reflection Coefficient, and Power Flow on a Lossless Transmission LineInput impedance and reflection coefficient; Power flow on a lossless transmission line; Traveling and Standing Waves on a Transmission Line; Traveling waves; Standing waves; Transmission Line Structures; Stripline; Microstrip; Coplanar Waveguides; Novel Transmission Lines; References; 2 PCB design for signal integrity; Differential Signaling; Impedance; Time Domain Analysis; Eye Diagram; Jitter; Jitter components and budget; Jitter amplification example; Frequency Domain Analysis; Spectral Content; Insertion Loss
  • Integrated Insertion Loss NoiseReturn Loss; S11 nulls; Crosstalk; Crosstalk sum; Integrated Crosstalk; Signal-to-Noise Ratio; Stack-Up Design; Impedance Target (Routing Impedance); Optimal routing impedance; PCB Losses; Dielectric Loss; Lower loss dielectrics; Hybrid stackups; Conductor Loss; Surface roughness; Crosstalk Mitigation through StackUp; Stripline dielectric; Solder mask; Dual Stripline; PCB stackup; Angled routing; Parallelism; Densely Broadside Coupled Dual Stripline; Via Stub Mitigation; Impedance optimization; U-turn via; Back-drilling; Blind and buried via
  • PCB Layout OptimizationLength Matching; Fiber Weave Effect; Crosstalk Reduction; Interleaving; Guard trace; Signal-to-ground ratio; Ground placement; Orthogonal placement; Component (vertical to horizontal) cancellation; Non-Ideal Return Path; Power Integrity; Repeaters; Introduction to re-timers; Introduction to re-drivers; Modeling and simulation; PCIe considerations; References; 3 Channel modeling and simulation; Transmission Lines; Causality; Checking for Model Causality; Causal Frequency-Dependent Model; Copper Surface Roughness; Modified Hammerstad model; Huray model; Conductivity
  • Environmental ImpactHumidity; Conductivity; Temperature; Model and simulation; Model Geometries; Stripline structures; Microstrip structures; Corner Models; Iterative corner model; Monte Carlo corner model; Ideal Assumptions: Homogeneous Impedance; Ideal Assumptions: Crosstalk Aggressors; Transmitters; IBIS Models; Spice Voltage Source Model; Linearity test; 3D Modeling; Ports/Terminals; Wave ports; Lumped ports; Model Analysis Settings; Discrete or interpolating solutions; Frequency range and step size; Port order; Normalize result to 50ohms; Plated-Through-Hole Via; Model Techniques
  • Pre-Layout Approximation
Dimensions
unknown
Edition
First edition.
Extent
1 online resource (268 p.)
Form of item
online
Isbn
9780124186637
Media category
computer
Media type code
c
Specific material designation
remote
System control number
  • (CKB)3710000000463912
  • (EBL)2166539
  • (SSID)ssj0001616424
  • (PQKBManifestationID)16346414
  • (PQKBTitleCode)TC0001616424
  • (PQKBWorkID)14919544
  • (PQKB)10192856
  • (MiAaPQ)EBC2166539
  • (EXLCZ)993710000000463912
Label
High speed digital design : design of high speed interconnects and signaling, Hanqiao Zhang, Steve Krooswyk, Jeff Ou
Publication
Copyright
Note
Includes index
Bibliography note
Includes bibliographical references and index
Carrier category
online resource
Carrier category code
cr
Content category
text
Content type code
txt
Contents
  • Front Cover; High Speed Digital Design; Copyright Page; Contents; About the Authors/Contributors; 1 Transmission line fundamentals; Basic Electromagnetics; Electromagnetics Field Theory; Maxwell's equations; Ampere's law; Faraday's law; Gauss's law; Gauss's law for magnetism; Propagation of Plane Waves; Uniform plane wave; Uniform plane wave in conductive media; Power flow and the Poynting vector; Transmission Line Theory; Wave Equations on Lossless Transmission Lines; Lossless transmission line; Wave propagation on a lossless transmission line; Incident waves and reflected waves
  • Impedance, Reflection Coefficient, and Power Flow on a Lossless Transmission LineInput impedance and reflection coefficient; Power flow on a lossless transmission line; Traveling and Standing Waves on a Transmission Line; Traveling waves; Standing waves; Transmission Line Structures; Stripline; Microstrip; Coplanar Waveguides; Novel Transmission Lines; References; 2 PCB design for signal integrity; Differential Signaling; Impedance; Time Domain Analysis; Eye Diagram; Jitter; Jitter components and budget; Jitter amplification example; Frequency Domain Analysis; Spectral Content; Insertion Loss
  • Integrated Insertion Loss NoiseReturn Loss; S11 nulls; Crosstalk; Crosstalk sum; Integrated Crosstalk; Signal-to-Noise Ratio; Stack-Up Design; Impedance Target (Routing Impedance); Optimal routing impedance; PCB Losses; Dielectric Loss; Lower loss dielectrics; Hybrid stackups; Conductor Loss; Surface roughness; Crosstalk Mitigation through StackUp; Stripline dielectric; Solder mask; Dual Stripline; PCB stackup; Angled routing; Parallelism; Densely Broadside Coupled Dual Stripline; Via Stub Mitigation; Impedance optimization; U-turn via; Back-drilling; Blind and buried via
  • PCB Layout OptimizationLength Matching; Fiber Weave Effect; Crosstalk Reduction; Interleaving; Guard trace; Signal-to-ground ratio; Ground placement; Orthogonal placement; Component (vertical to horizontal) cancellation; Non-Ideal Return Path; Power Integrity; Repeaters; Introduction to re-timers; Introduction to re-drivers; Modeling and simulation; PCIe considerations; References; 3 Channel modeling and simulation; Transmission Lines; Causality; Checking for Model Causality; Causal Frequency-Dependent Model; Copper Surface Roughness; Modified Hammerstad model; Huray model; Conductivity
  • Environmental ImpactHumidity; Conductivity; Temperature; Model and simulation; Model Geometries; Stripline structures; Microstrip structures; Corner Models; Iterative corner model; Monte Carlo corner model; Ideal Assumptions: Homogeneous Impedance; Ideal Assumptions: Crosstalk Aggressors; Transmitters; IBIS Models; Spice Voltage Source Model; Linearity test; 3D Modeling; Ports/Terminals; Wave ports; Lumped ports; Model Analysis Settings; Discrete or interpolating solutions; Frequency range and step size; Port order; Normalize result to 50ohms; Plated-Through-Hole Via; Model Techniques
  • Pre-Layout Approximation
Dimensions
unknown
Edition
First edition.
Extent
1 online resource (268 p.)
Form of item
online
Isbn
9780124186637
Media category
computer
Media type code
c
Specific material designation
remote
System control number
  • (CKB)3710000000463912
  • (EBL)2166539
  • (SSID)ssj0001616424
  • (PQKBManifestationID)16346414
  • (PQKBTitleCode)TC0001616424
  • (PQKBWorkID)14919544
  • (PQKB)10192856
  • (MiAaPQ)EBC2166539
  • (EXLCZ)993710000000463912

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