The Resource Silver Metallization : Stability and Reliability, by Daniel Adams, Terry L. Alford, James W. Mayer, (electronic resource)

Silver Metallization : Stability and Reliability, by Daniel Adams, Terry L. Alford, James W. Mayer, (electronic resource)

Label
Silver Metallization : Stability and Reliability
Title
Silver Metallization
Title remainder
Stability and Reliability
Statement of responsibility
by Daniel Adams, Terry L. Alford, James W. Mayer
Creator
Contributor
Author
Author
Subject
Language
  • eng
  • eng
Summary
Silver has the lowest resistivity of all metals, which makes it an attractive interconnect material for higher current densities and faster switching speeds in integrated circuits. Over the past ten years, extensive research has been conducted to address the thermal and electrical stability, as well as processing issues which, to date, have prevented the implementation of silver as an interconnect metal. Silver Metallization: Stability and Reliability is the first book to discuss current knowledge of silver metallization and its potential as a favorable candidate for implementation as a future interconnect material for integrated circuit technology. Silver Metallization: Stability and Reliability provides detailed information on a wide range of experimental, characterization and analysis techniques. It also presents the novel approaches used to overcome the thermal and electrical stability issues associated with silver metallization. Readers will learn about the: preparation and characterization of elemental silver thin films and silver-metal alloys; formation of diffusion barriers and adhesion promoters; evaluation of the thermal stability of silver under different annealing conditions; evaluation of the electrical properties of silver thin films under various processing conditions; methods of dry etching of silver lines and the integration of silver with low-k dielectric materials. As a valuable resource in this emerging field; Silver Metallization: Stability and Reliability will be very useful to students, scientists, engineers and technologists in the fields of integrated circuits and microelectronics research and development
Member of
http://library.link/vocab/creatorName
Adams, Daniel
Dewey number
  • 621.3815
  • 669.23
http://bibfra.me/vocab/relation/httpidlocgovvocabularyrelatorsaut
  • WOiSTTSlpf0
  • ZAyGMBmwdqk
  • XIri8TgjMLM
Language note
English
LC call number
  • QC176.8.S8
  • QC611.6.S9
  • QC176.84.S93
Literary form
non fiction
Nature of contents
dictionaries
http://library.link/vocab/relatedWorkOrContributorName
  • Alford, Terry L.
  • Mayer, James W.
Series statement
Engineering Materials and Processes,
http://library.link/vocab/subjectName
  • Industrial engineering
  • Materials
  • Surfaces (Physics)
  • Manufactures
  • Surface and Interface Science, Thin Films
  • Industrial and Production Engineering
  • Metallic Materials
  • Surfaces and Interfaces, Thin Films
  • Manufacturing, Machines, Tools, Processes
Label
Silver Metallization : Stability and Reliability, by Daniel Adams, Terry L. Alford, James W. Mayer, (electronic resource)
Instantiates
Publication
Note
Description based upon print version of record
Bibliography note
Includes bibliographical references and index
Carrier category
online resource
Carrier category code
  • cr
Content category
text
Content type code
  • txt
Contents
Silver Thin Film Characterization -- Diffusion Barriers and Self-encapsulation -- Thermal Stability -- Silver Electromigration Resistance -- Integration Issues -- Summary
Dimensions
unknown
Edition
1st ed. 2008.
Extent
1 online resource (133 p.)
Form of item
online
Isbn
9786611117863
Media category
computer
Media type code
  • c
Other control number
10.1007/978-1-84800-027-8
Specific material designation
remote
System control number
  • (CKB)1000000000491568
  • (EBL)338012
  • (OCoLC)209987335
  • (SSID)ssj0000246041
  • (PQKBManifestationID)11210556
  • (PQKBTitleCode)TC0000246041
  • (PQKBWorkID)10180450
  • (PQKB)11447946
  • (DE-He213)978-1-84800-027-8
  • (MiAaPQ)EBC338012
  • (EXLCZ)991000000000491568
Label
Silver Metallization : Stability and Reliability, by Daniel Adams, Terry L. Alford, James W. Mayer, (electronic resource)
Publication
Note
Description based upon print version of record
Bibliography note
Includes bibliographical references and index
Carrier category
online resource
Carrier category code
  • cr
Content category
text
Content type code
  • txt
Contents
Silver Thin Film Characterization -- Diffusion Barriers and Self-encapsulation -- Thermal Stability -- Silver Electromigration Resistance -- Integration Issues -- Summary
Dimensions
unknown
Edition
1st ed. 2008.
Extent
1 online resource (133 p.)
Form of item
online
Isbn
9786611117863
Media category
computer
Media type code
  • c
Other control number
10.1007/978-1-84800-027-8
Specific material designation
remote
System control number
  • (CKB)1000000000491568
  • (EBL)338012
  • (OCoLC)209987335
  • (SSID)ssj0000246041
  • (PQKBManifestationID)11210556
  • (PQKBTitleCode)TC0000246041
  • (PQKBWorkID)10180450
  • (PQKB)11447946
  • (DE-He213)978-1-84800-027-8
  • (MiAaPQ)EBC338012
  • (EXLCZ)991000000000491568

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